(click on the links for actual repair images)

Manufacturing Defects
Most of these are easily repaired.

ECO/Upgrades
rerouting traces, adding plate through holes, adding pads/traces and entire arrays, fabrication/dimensional changes to relocating keying slots and actual board dimensions, *All held within 1/thousandths tolerance.

Base Material Problems
Smashed corners, burns delaminations and measlting

Interlayer Traces Repaired
Due to shorted traces and manufacturing shorts and opens on any layer

External Traces Repaired
Due to shorted traces and manufacturing shorts

Lifted, Damaged or Missing Pads
- including BGA pads and Micro Blind via SMT pads.
Making conection from beneth the pads.

Gold Contact Repair/Edge Connectors
- replacement of gold contacts and any kind of gold contact problem such as scratches, pits solder, and any other contamination problems

Plated Thru Holes Repaired
- including new barrels with innerlayer connections with surface barrel pads and any open vias